IM4000II & ArBlade 5000

Reduce turnaround times without compromising sample integrity.

• The IM4000II achieves a 500 μm/h milling rate, while the ArBlade 5000 offers an impressive 1 mm/h or more (for Si sample with protrusion of 100 μm).
  
  
• Perfect for hard materials like metals and semiconductors that need extended milling.

Get the flexibility to prepare samples exactly how you need them.

• Cross-section milling produces smooth, undistorted surfaces without mechanical stress—ideal for examining internal structures of composite materials, multilayer films, and electronic components.
  
  
• Flat milling removes surface layer artifacts for high-contrast imaging, essential for applications like EBSD.

Easily prepare large samples with confidence.

• Enables milling up to 10 mm in width, so it's ideal for electronic devices and industrial materials.
  
  
• Provides a uniform cross-section across large samples, improving accuracy in imaging and analysis.

Preserve sample integrity for high-resolution imaging.

• Optional Cooling Temperature Control feature for the IM4000II and ArBlade 5000 prevents heat damage to delicate materials like polymers.
  
  
• Maintains a precise temperature range (0°C to -100°C) using liquid nitrogen.

Ensure contamination-free imaging for air-sensitive samples.

• Compatible with Hitachi SEMs and third-party systems for streamlined workflows.
  
  
• Air protection Holder Unit (available for both IM4000II and ArBlade 5000) allows samples transfer to SEM or AFM without exposure to air.